P_2x4B_082

P_2x4B_082_A

Parts committed by Bolla Gino on date 12/18/2006

Part	ID
BBM	BBM_082-2x4B
VHDI	2x4_324

ROC ROC wafer Label

ROC0 W32_XA4K5NT 40B

ROC1 W32_XA4K5NT 40A

ROC2 W32_XA4K5NT 58D

ROC3 W32_XA4K5NT 58B

ROC4 W32_XA4K5NT 37D

ROC5 W32_XA4K5NT 38A

ROC6 W32_XA4K5NT 39A

ROC7 W32_XA4K5NT 39C

ROC	ROC wafer	Label
ROC0	W32_XA4K5NT	40B
ROC1	W32_XA4K5NT	40A
ROC2	W32_XA4K5NT	58D
ROC3	W32_XA4K5NT	58B
ROC4	W32_XA4K5NT	37D
ROC5	W32_XA4K5NT	38A
ROC6	W32_XA4K5NT	39A
ROC7	W32_XA4K5NT	39C

Inspected by Lockwood Gale on date 12/20/2006

LR_dev 0.259

LL_dev 0.250

FINAL COMMENT by Lockwood Gale BBM is mis-aligned, shifted toward the HDI pads by 0.250 mm w.r.t.ideal location on VHDI. No problem wirebonding.

PLAQUETTE made READY for testing on 12/20/2006 by Lockwood Gale

P_2x4B_082_Aon 12/21/2006 9:52 AM P_2x4B_082_A-1on 12/21/2006 10:07 AM

PLAQUETTE TESTED on 2006-12-21 by Gino Bolla at ROOM temperature before encapsulation

Results at ROOM temperature before encapsulation

PLAQUETTE cooled down to ~-20C on 01/05/2007 by Petra Merkel

P_2x4B_082_A-5on 01/05/2007 9:52 AM P_2x4B_082_A-6on 01/05/2007 10:07 AM

PLAQUETTE TESTED on 2007-01-05 by Gino Bolla

IV_XML-File

Maximum Voltage 420 V

LASER_XML-File

Depletion Voltage 10 V

Operational Voltage 50 V

ROC	ROC0	ROC1	ROC2	ROC3	ROC4	ROC5	ROC6	ROC7
Ibias_DAC	108	114	128	140	124	120	110	128
Vana	137	161	158	172	156	155	150	151
Cal_Del	80	94	95	79	85	87	86	87
Vthrs_Comp	74	78	74	85	68	76	77	85
Unbumped	0	0	0	0	0	0	0	0
Dead	0	1	0	0	0	0	0	0
Noisy	0	0	0	0	0	0	0	0
Undecoded	0	0	0	0	0	0	0	0
Total BAD	0	1	0	0	0	0	0	0

ASSEMBLY_XML-File	SUMMARY_XML-File, and SUMMARY_PER_ROC_XML-File
	I_BIAS_DAC_XML-File
	VANA_XML-File
	DEAD_XML-File
	NOISY_XML-File
	UNDECODED_XML-File
	LIGHT_XML-File

PLAQUETTE READY FOR ENCAPSULATION

P_2x4B_082_A-7on 1/8/2007 10:15 AM